Flex Solder Mask for COF NPR-90 | Nippon Polytech Corp.

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The FPC used by these grades shows an excellent flatness, so that the grade exercises the performance in solving a warpage problem of FPC.
And it is expected that a cracking problem during manufacturing FPC is reduced by reason of showing excellent flexibility right after UV exposure.

Possessing an excellent flexibility.
Maintaining a flatness of FPC.
Possessing an excellent characteristic of PCT. (121°C 100%RH, 192hrs over)
Possessing an excellent performance for chemical Au plating.
Showing a good performance for several reliability tests.

Ink Characteristics

Item	Typical value	Test Condition
Viscosity	200∼300 dPa·s	VT-04 Viscometer (RION 25°C)
Thixotropic index	1.0∼2.0	HBT Viscometer (BROOKFIELD 25°C) η₅/η₅₀

Characteristics

Item		Typical value	Test Condition
Pencil hardness		3H	JIS K 5600
Adhesion	(Cu)	Class. 0	JIS K 5600 (on copper foil)
Adhesion	(PI)	Class. 0	JIS K 5600 (on polyimide film)
Heat resistance to solder		≧ 1 time	10sec. on solder bath at 260±5°C
Insulation resistance		≧ 1.0 x 10¹²Ω	50/50μm (Line/Space), Comb type test pattern
Flexibility		≧ 2 times	On polyimide film (25μm) 180° bending at diameter of 0.2mm
Warpage		< 1mm	25μm / Single side coat
Resistance to chemical Au plating		PASS	Ni 3μm / Au 0.03μm thickness
Resistance to acid		PASS	10% HCI aq., 25°C, 30min. Dipping
Resistance to alkaline		PASS	5% NaOH aq., 25°C, 30min. Dipping
Resistance to organic solvent		PASS	IPA, 25°C, 30min. Dipping

The value in the table is measured by NPT based on each test method, so that these values are not guaranteed.

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Standard process


Screen Printing Slit coating Spray coating		70∼80°C 30min.		400∼600mJ/cm²		1% Na₂CO₃ aq. 30°C 0.2MPa		150°C 30min.

Type

Product code	Color	Application	Features
B106D	Blue	COF, General FPC, etc.	Low warpage Supreme flexibility Halogen free

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