Flex Solder Mask for COF NPR-90 | Nippon Polytech Corp.

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The FPC used by these grades shows an excellent flatness, so that the grade exercises the performance in solving a warpage problem of FPC.
And it is expected that a cracking problem during manufacturing FPC is reduced by reason of showing excellent flexibility right after UV exposure.

Springback is small, possessing an excellent flexibility.
Maintaining a flatness of FPC.
Improvement of heat resistance.
Possessing an excellent performance for chemical Au plating.
Showing a good performance for several reliability tests.
Halogen free (JPCA, IEC) and RoHS Directive are supported.

Ink Characteristics

Item	Typical value	Test Condition
Viscosity	170∼270 dPa·s	VT-04 Viscometer (RION), 25deg.C
Thixotropic index	1.0∼2.0	HBT Viscometer (BROOKFIELD), η₅/η₅₀, 25deg.C

Characteristics

Item		Typical value	Test Condition
Pencil hardness		4H	JIS K 5600
Adhesion	(Cu)	Class. 0	JIS K 5600 (on copper foil)
Adhesion	(PI)	Class. 0	JIS K 5600 (on polyimide film)
Heat resistance to solder		≧ 2 times	5sec. on solder bath at 260±5deg.C
Insulation resistance		≧ 1.0 x 10¹²Ω	50/50μm (Line/Space), Comb type test pattern
Flexibility		≧ 2 times	On polyimide film (25μm), 180deg. bending at diameter of 0.2mm
Springback		0.5N/cm	On polyimide film (25μm), 5mm/min., Outside bending
Warpage		< 1mm	25μm / Single side coat
Resistance to chemical Au plating		PASS	Ni 3μm / Au 0.03μm thickness
Resistance to acid		PASS	10% HCI aq., 25deg.C, 30min. Dipping
Resistance to alkaline		PASS	5% NaOH aq., 25deg.C, 30min. Dipping
Resistance to organic solvent		PASS	IPA, 25deg.C, 30min. Dipping

The value in the table is measured by NPT based on each test method, so that these values are not guaranteed.

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Standard process


Screen Printing		70∼80deg.C 30min.		400∼600mJ/cm²		1% Na₂CO₃ aq. 30deg.C 0.2MPa		150deg.C 30min.

Type

Product code	Color	Application	Features
305B	Blue	LCD Module General FPC etc.	Low warpage Supreme flexibility Halogen free

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