NPR-5 Series

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Flex Solder Mask(2 component type)


NPR-5, curable typed solder mask, consisting of epoxy resin is suitable for FPC.
These grades withstand hard crease of FPC, and then enable to maintain the flatness of FPC.
The UV radiation process and developing process are not required.

Ink Characteristics

Item BR-HF No.13 NBD NF61BR Test Condition
Color Brown Green Brown Visual
Viscosity 220∼280 dPa·s VT-04 Viscometer (RION), 25deg.C
Thixotropic index 13∼23 7∼17 HBT Viscometer (BROOKFIELD),
η1/η100, 25deg.C
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Characteristics

Item BR-HF No.13 NBD NF61BR Test Condition
PencilHandness HB 3H F JIS K 5600
Adhesion (Cu) Class. 0 JIS K 5600 (on copper foil)
(PI) Class. 0 JIS K 5600 (on polyimide film)
Heat resistance to solder ≧ 2 times 5sec., on solder bath at 260±5deg.C
Insulation resistance ≧ 1.0 x 1012Ω 50/50μm (Line/Space), Comb type test pattern
Flexibility ≧ 1 time On polyimide film (25μm)
180deg. bending at diameter of 0.2mm
Warpage < 1mm ≦ 10mm < 1mm 25μm PI / Single side coat
Resistance to chemical Au plating PASS Ni 3μm / Au 0.03μm thickness
Resistance to acid PASS 10% HCl aq. 25deg.C, 30min. Dipping
Resistance to alkaline PASS 5% NaOH aq. 25deg.C, 30min. Dipping
Resistance to organic solvent PASS IPA, 25deg.C, 30min. Dipping
UL94 - - V-0 UL94 standard
Bleed Fair Excellent Fair NPT method

The value in the table is measured by NPT based on each test method, so that these values are not guaranteed.

Standard process

Coating Curing
Screen Printing   150deg.C
20∼30min.

Applications

COF, TAB, Pickup device (DVD,CD), etc.

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